Board-stacking interposer for high-density parallel PCB assemblies
The Hirose FunctionMax FX10-168IP-8H(03) is a 168-position interposer on 0.020" (0.50mm) pitch, designed to sit between two parallel PCBs in a mezzanine stack. With a mated stack height range of 8mm to 10mm, it sets the board-to-board gap for the whole assembly. The 2-row layout keeps the footprint narrow, which helps route traces out of the dense 0.50mm pitch field.
168 positions at 0.50mm pitch — matching the BOM channel count
At 168 positions, this interposer fills a high-I/O BOM line where the signal count matches the position count exactly. Compared to the 144-position FX10-144IP-8H(03) from the same FunctionMax FX10 series, the 168-position version adds 24 signal lanes at the same 0.50mm pitch and 30.0µin gold plating. The extra positions widen the board footprint by the same number of contacts per row — check that the PCB land pattern accommodates the full 168 pads before committing the layout.
Active production — no end-of-life pressure on this BOM line
ROHS3 compliant per the listing.