Hirose FX11LA-120S/12-SV(71) — 120-Position, 0.50 mm Pitch Mezzanine Receptacle
The Hirose FX11LA-120S/12-SV(71) is a 120-position receptacle with center strip contacts from the FX11 series, designed for board-to-board mezzanine stacking in space-constrained portable electronics. It uses a 0.020" (0.50mm) pitch across two rows, with a 1.65mm height above the board and a 2mm mated stacking height — a tight z-budget typical of ultra-thin devices like smartphones, tablets, and wearables. Key features include an integrated board guide for alignment during assembly, a ground plate for low-impedance return path and EMI management, and solder retention tabs for SMT reflow stability.
Together they set the mezzanine gap, so confirm both against your board stack-up and enclosure z-height budget before layout.
Mounting and Assembly Considerations
The board guide aids pick-and-place alignment and prevents skew during reflow. The ground plate is soldered to a corresponding pad on the PCB — ensure your footprint includes the ground pad and that your reflow profile is compatible with the solder retention feature.
No end-of-life notice or successor has been announced.