The Hirose FX11LA-60S/6-SV(71) is a 60-position receptacle with center strip contacts from the FX11 series, designed for parallel board-to-board mezzanine stacking. Gold-plated contacts with 4.00 µin thickness handle moderate mating cycles typical of internal device interconnects. The 2 mm mated stacking height suits low-profile assemblies — think smartphone mainboards, tablet display drivers, or portable instrument logic boards where the z-height budget is under 3 mm.
Traces between pads need careful clearance; a 4-layer board with microvias is typical. The ground plate runs the length of the connector body, providing a low-inductance return path that keeps signal integrity clean on high-speed lines. The gold contact finish at 4.00 µinch is adequate for signal-level currents in controlled environments.
The FX11LA-60S/6-SV(71) shares the same 0.50 mm pitch, 1.65 mm height above board, and 2 mm stacking height as the 80-position FX11LA-80S/8-SV(71) and the 100-position FX11LA-100S/10-SV(71). All three use the same footprint class, so scaling signal density up or down doesn't require a board layout change. The FX11LA-60S/6-SV(91) is electrically and mechanically identical to this part; the only difference is packaging — Tape & Reel versus Tray. If your pick-and-place line is set for reel feed, the (91) variant is the direct swap.