The Hirose FX11LA-80P/8-SV(92) is an 80-circuit header from the FX11 series, designed for board-to-board mezzanine stacking where the z-axis budget is tight. When mated with the matching FX11 receptacle, the total stack height is 2 mm — a common gap for parallel PCB stacking in compact handheld or portable equipment. The connector includes a board guide to help align the two halves during assembly, plus a ground plate that provides a low-inductance return path and some EMI containment between the stacked boards. Gold-plated contacts with 4.00 µm thickness handle the mating cycles typical of a production assembly — adequate for a few dozen matings, but not designed for frequent field reconnection.
At 0.50 mm pitch, trace escape from the inner rows requires either micro-vias or a tightly staggered via pattern. The 80 positions across two rows give 40 contacts per row, so the connector body length is about 20 mm — a compact footprint for the circuit count. The 1.90 mm height above board means this header sits low enough to fit under a secondary board in a clamshell or stacked-PCB assembly, but the keep-out zone on the bottom board must clear the shroud and ground plate tabs. Compared to the FX11LA-100P/10-SV(92) sibling, this 80-position version uses the same 0.50 mm pitch and same 1.90 mm height but with 20 fewer circuits. If your BOM calls for 80 signals, this is the exact position match; the 100-position variant would leave 20 unconnected positions, which is wasteful but electrically harmless. The FX11LA-80P/8-SV(71) is identical in every spec except packaging — it ships in tray rather than tape-and-reel, so if your pick-and-place line is set up for tape-fed parts, the (92) suffix is the one to use.
It is ROHS3 compliant. No official cross-reference or second-source is on record; the only functional equivalent is the tray-packaged (71) suffix variant.