Hirose FX11 Receptacle, 140 Circuits, 0.50 mm Pitch
It uses a 0.020" (0.50mm) pitch across two rows, with gold-plated contacts at 4.00µin (0.100µm) thickness. The connector mounts via surface-mount technology and includes solder retention features to hold it flat through reflow. With a mated stacking height of 2 mm and a height above board of 0.065" (1.65mm), it fits tight z-axis budgets in compact electronics like laptops, tablets, and handheld instrumentation.
At 0.50 mm pitch, this connector demands a tight board layout — the trace escape between pads is narrow, and the footprint requires a controlled impedance stack-up if running high-speed signals. The 140 positions fill the full width of a typical mezzanine interface, so the board area needed is roughly 35 mm long for the two rows. The 2 mm mated stack height is a specific z-height — confirm the opposite board's component keep-out clears this gap.