80-Position SMT Receptacle for Dense Parallel Board Interfaces
The Hirose FX2-80S-1.27SV(71) is an 80-position receptacle from the FX2 series, designed for board-to-board parallel stacking where signal density drives the layout. The 1.27 mm pitch packs 80 circuits into a dual-row format, keeping the board footprint compact while routing traces between the pads. Outer shroud contacts guide the mating header into alignment and protect the signal pins from mechanical damage during engagement — a detail that matters when the connector sits deep in an enclosure and the mate cycle is blind. Gold plating on the contacts (7.87µin / 0.200µm) suits this receptacle for signal-level duty with moderate mating cycle expectations — think test equipment, industrial control boards, or telecom line cards where the connector sees tens to low hundreds of mates over its life. The surface-mount termination matches a standard reflow profile, though the 80-position count means the paste deposition and stencil aperture need attention to avoid bridging on the inner rows.
The dual-row, 80-position layout defines a rectangular footprint roughly 50 mm long; the outer shroud adds width beyond the contact rows, so the keep-out zone on the board must account for the shroud walls, not just the solder pads. Surface-mount pads on a 1.6 mm board typically need a 0.30 mm stencil for good solder joint volume on the outer rows.
This receptacle mates with the FX2 series pin header (male) connectors at the same 1.27 mm pitch. The outer shroud contacts on the receptacle side wrap around the header's inner contacts, so the mating pair self-aligns during engagement — no fumbling with alignment pins. The stack height between boards depends on the specific header height selected; the FX2 series offers several header post heights to match different board-to-board spacing requirements.