The Hirose FunctionMax™ FX30B-2P-7.62DSA25 is a 2-position, single-row board-to-board header with a 7.62 mm pitch, designed for power distribution between parallel PCBs at a fixed 25 mm mated stack height. The shrouded 2-wall housing in black UL94 V-0 nylon includes integral board locks and a board guide for alignment during assembly. This is a through-hole solder-terminated header in the FunctionMax™ FX30B series, suited for applications where a compact, high-current board-to-board interconnect is needed — such as power supplies, industrial control modules, and server backplanes.
Pitch, Stack Height, and Board Footprint
The 7.62 mm pitch is wider than the 3.81 mm pitch of the FX30B-2P-3.81DSA20, which gives more creepage and clearance for the 250 V rating — the wider pitch also means a larger board footprint, so the 3.81 mm sibling is the choice for tighter routing density. The 25 mm mated stack height is fixed; the FX30B-2P-7.62DSA30 offers the same pitch and current but a 30 mm stack height, which changes the z-height budget between boards.
16 A per contact is the headline rating — that is bus-level current for a 2-position header, so each blade carries the full DC rail in a power interconnect. The rectangular blade contact shape gives a larger surface area than a round pin for the same pitch, which helps with current density and temperature rise.
It is ROHS3 compliant.