Board-Stacking Header for Dense Parallel Interconnects
The Hirose FX4C3-80P-1.27DSA(71) is an 80-position header from the FX4 series, designed for board-to-board mezzanine stacking. The through-hole mounting gives a solid solder joint for the dense pin count, and the 0.275" (6.99mm) height above board works with the listed mated stacking heights of 8mm, 10mm, or 11mm depending on the receptacle half chosen. The 80 positions fill a wide data or control bus in a single connector, keeping the board footprint compact.
Pitch and Stacking Height Drive the Board Layout
At this pitch, the escape routing between pads is tight — expect to use micro-vias or fine-line traces for the inner rows. The mated stacking height options (8mm, 10mm, 11mm) let you tune the z-height between boards without changing the header footprint, as long as the receptacle half matches the chosen height. Through-hole termination gives the mechanical strength to handle the insertion force of 80 contacts. The header body is keyed by the outer shroud geometry — no separate keying pin needed, but the mating receptacle must be the correct FX4 series center-strip type.