Board-to-Board Mezzanine Header for 0.80mm Pitch Routing
The Hirose FX6-20P-0.8SV1(71) is a 20-position surface-mount header from the FX6 series, designed for parallel board stacking with a 0.031" (0.80mm) pitch that keeps the footprint tight for dense PCB layouts. Gold contact finish is standard across the series, suited for the moderate mating-cycle counts typical of mezzanine interconnects in production equipment or test fixtures.
Stack Height Options — One Header, Two Mating Distances
This header carries a 0.236" (6.00mm) height above the board, but the FX6 series supports mated stacking heights of 6mm and 8mm with the appropriate receptacle. That gives the board designer one BOM line for the header while leaving a 2mm vertical tolerance band for the mating half — useful when the same header feeds into an 8mm stack on one assembly and a 6mm stack on another. The closest sibling is the FX6-20P-0.8SV(71), which shares the same 20-position count and 0.80mm pitch but stands 0.197" (5.00mm) above the board. If your z-height budget is 5mm rather than 6mm, that variant is the drop-in swap for the same footprint and receptacle family.