Mezzanine Receptacle for 0.80mm Pitch Board-Stacking
The Hirose FX6-40S-0.8SV2(93) is a 40-position receptacle with center strip contacts, part of the FX6 series of fine-pitch board-to-board mezzanine connectors. The 0.031" (0.80mm) pitch and dual-row layout pack 40 circuits into a compact footprint — each row carries 20 positions, which keeps the board-edge routing manageable for dense PCB layouts. Gold contact finish on both mating surfaces gives this connector the corrosion resistance and cycle life expected in production equipment that sees repeated board mating. The center strip contact design is worth noting: it provides a continuous ground or power plane through the middle of the connector, not just individual signal pins. That gives better return-path control for high-speed signals compared to a standard two-row header, and it can carry higher current across the plane than individual contacts would support.
Stack Height Range and Board Layout Fit
This receptacle supports three mated stacking heights: 7mm, 8mm, and 9mm. The 0.236" (6.00mm) height above board is the receptacle's own profile; the total mated height depends on which plug height you pair it with. That gives board layout engineers flexibility to adjust the z-axis budget without changing the receptacle footprint — useful when the same base board needs to stack with different daughter cards in a product family. Against the FX6-40S-0.8SV(71) sibling, which has a 0.157" (4.00mm) height above board and supports only a single stack height, this SV2 variant with 0.236" (6.00mm) height is the taller option that opens the 7-9mm stacking range. The 40-position count matches the seed part exactly, so the BOM line swaps only on the z-height requirement. The 50-position FX6-50S-0.8SV2(71) shares the same 0.236" height and stacking range but adds 10 more circuits — choose that one when the signal count exceeds 40 and the board real estate can take the extra width.
Surface Mount Assembly and Packaging
Surface mount termination means this receptacle reflows alongside other SMD components — no secondary wave-solder pass. The Tape & Reel packaging suits automated pick-and-place lines; the Cut Tape option works for prototype or low-volume builds.