The Hirose FX6-60S-0.8SV(71) is a 60-position, 0.80 mm pitch mezzanine receptacle with center strip contacts, designed for parallel board-to-board stacking in space-constrained electronics. It sits in the FX6 series, a fine-pitch interconnect family built for high-density signal routing between stacked PCBs.
The 0.80 mm pitch sets the routing density — fine enough for 60 signals in a small PCB area, but not so tight that standard 4-layer board houses can't escape traces between pads. The 0.157" (4.00 mm) height above board is the unmated component profile; the mated stack height options of 5 mm, 6 mm, and 7 mm let you pick the board spacing that fits your enclosure z-height budget.