The Hirose FX8-120P-SV(91) is a 120-position header from the FunctionMax™ FX8 series, designed for high-density board-to-board mezzanine stacking. With a 0.024" (0.60mm) pitch and two rows of gold-plated contacts, it mates with the matching FX8 receptacle to create a parallel-board interconnect at a 3mm mated stack height. The surface-mount termination and integrated board guide simplify alignment during reflow assembly, making this part a fit for compact electronics where routing density and a low z-height budget are the constraints.
The header itself sits 0.112" (2.85mm) above the board surface, so the total height from the bottom PCB to the top of the header is that figure plus the receptacle's own height. The 0.60mm pitch forces fine trace routing and via fan-out under the connector; expect to use micro-vias or blind vias to escape the inner rows on a standard PCB stack-up.
The FX8-120P-SV(91) shares the same 120-position count, 0.60mm pitch, and gold-plated contacts as the FX8-120P-SV1(91), but the SV1 variant uses a taller 0.152" (3.85mm) height above board, which increases the mated stack height to roughly 4mm. If your board-to-board gap is fixed at 3mm, the SV(91) is the correct choice; the SV1(91) would require a taller enclosure or a different receptacle. The FX8-120P-SV(92) is identical in dimensions but ships in Tape & Reel for automated assembly lines, while the FX8-120P-SV(71) comes in a tray — the part itself is the same.
No official second-source or cross-reference exists beyond the FX8 series siblings listed above.