The Hirose FX8-60P-SV(91) is a 60-position header from the FunctionMax™ FX8 series, designed for parallel board-to-board stacking at a 3mm mated stack height. With a 0.024" (0.60mm) pitch across two rows, it carries gold-plated outer shroud contacts and includes an integral board guide for alignment during assembly. This is a high-density signal interconnect — the fine pitch and gold plating suit repeated mating cycles in compact electronics where routing density matters more than per-contact current capacity.
This header is designed to mate with the matching FX8 series receptacle to achieve a 3mm mated stack height between parallel PCBs. The 0.112" (2.85mm) height above board on the header side, combined with the receptacle height, defines the total board-to-board gap.