100-Position Board-to-Board Header at 0.60mm Pitch
The Hirose FX8C-100P-SV1(71) is a 100-position header from the FunctionMax™ FX8C series, designed for high-density board-to-board stacking. Its 0.024" (0.60mm) pitch packs a lot of I/O into a small footprint — the board layout needs a controlled impedance stack-up and fine-line routing to keep signal integrity between those tight pads. The header sits 0.214" (5.45mm) above the board and supports mated stacking heights of 6mm and 11mm with the matching receptacle — a single BOM line that covers two different board-to-board gaps.
Stack Height Selection
The FX8C-100P-SV1(71) is spec'd for mated stacking heights of 6mm and 11mm. If your board stack needs a taller gap, the sibling FX8C-100P-SV4(71) shares the same 100 positions and 0.60mm pitch but stands 0.333" (8.45mm) above the board — that shifts the mated stack height upward. Pick the height that matches your enclosure's z-budget.