High-Density Board-to-Board Header for Tight Stack-Up Budgets
At a 0.024" (0.60mm) pitch across two rows, it packs 100 circuits into a footprint that keeps routing dense without forcing a multilayer board.
Stack Height Selection and Board Layout Fit
This variant supports mated stacking heights of 9mm and 14mm, giving the board designer two z-height budgets from one header. The 0.333" (8.45mm) height above board places the mating interface well clear of tall components on the top layer — useful when the bottom board carries electrolytic caps or inductors. Surface mount termination with the board guide keeps the part stable during reflow; the guide posts engage the receptacle's alignment holes before the contacts touch, so the fine-pitch beams don't stub on the mating shroud.