0.60mm Pitch, 100-Position Board-to-Board Header
The Hirose FX8C-100P-SV6(93) is a 100-position header from the FunctionMax™ FX8C series, using a 0.024" (0.60mm) pitch in a dual-row layout. It is a surface-mount, outer-shroud-contact header designed for parallel board stacking. The gold-plated contacts and integrated board guide make it a fit for high-density signal interconnects where the board-to-board gap is tight and the position count is high. The 0.60mm pitch means the board footprint is compact — you are routing fine traces between pads, not standard 0.100-inch lines.
Stacking Heights: 11mm or 16mm
This header supports two mated stacking heights: 11mm and 16mm. The 0.427" (10.85mm) height above the board is the header's own profile; the mating receptacle determines the final stack. If your assembly needs a 11mm or 16mm gap between parallel PCBs, this part covers both without a change in the header itself.
Position Count and Sourcing
At 100 positions, this header matches a 100-circuit BOM line exactly. The lifecycle status is Active, so there is no last-time-buy pressure on this order code.