100-Position SMT Header at 0.60 mm Pitch
The Hirose FX8C-100P-SV(91) is a 100-position, 2-row header from the FunctionMax™ FX8C series, designed for high-density board-to-board stacking. Its defining feature is the 0.024" (0.60mm) pitch — that 0.60 mm centerline drives the entire board footprint: trace widths, via keepouts, and the escape routing for 50 contacts per row. This is a surface-mount part, so the reflow profile and solder-paste stencil aperture for those 0.60 mm-pitch pads need to be dialed in for the gold-plated contact tails.
Lifecycle and Sourcing Position
The BOM line can be committed without a contingency for a pending obsolescence notice.
