The Hirose FX8C-100P-SV(93) is a 100-position header from the FunctionMax™ FX8C series, designed as a board-to-board mezzanine interconnect. The header stands 0.175" (4.45mm) above the board and supports mated stacking heights of 5mm and 10mm, giving the board-stacking engineer two z-height options from a single footprint. A built-in board guide aligns the mating receptacle during assembly, taking shear off the signal pins. This connector is used in compact electronic assemblies where high-density routing and a low-profile mezzanine connection are required — think portable equipment, handheld instruments, and server mezzanine cards.
It drives the PCB footprint: the pad width and spacing require a controlled impedance stack-up if signals run at high edge rates, and the soldering process needs a reflow profile tuned for fine-pitch SMT. The 100 positions across two rows means 50 contacts per row, so the breakout traces between pads will be narrow — expect 0.15 mm to 0.20 mm trace widths with 0.15 mm clearance in a standard PCB fab. The board guide helps the mating receptacle self-align, which reduces the risk of bent pins during hand assembly or field rework.
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