It uses a 0.60mm pitch dual-row layout with gold-plated outer shroud contacts, surface-mounted to the PCB. The header includes an integral board guide to align the mating receptacle during assembly, reducing shear stress on the signal pins. Typical applications include high-density internal interconnects in telecom switches, server backplanes, and portable instrumentation where the 120 circuits pack into a compact footprint.
Stack Height Selection and Board Layout
This header supports two mated stacking heights — 7mm and 12mm — depending on the mating FX8C receptacle variant used. The 0.60mm pitch demands careful trace routing: at this density, a 4-layer board with microvias is typical to escape the inner rows. The board guide is a molded alignment post that keys into the receptacle's guide slot, preventing skew during mating.
No official second-source cross-reference is on record; the Hirose FX8C series is the sole supply path.