What This 120-Position Header Does in a Board Stack
The Hirose FX8C-120P-SV(91) is a 120-position, 2-row header from the FunctionMax™ FX8C series, designed for parallel board-to-board stacking. The 0.60 mm pitch packs 120 gold-plated contacts into a compact SMT footprint — the contact density is what drives the board layout, not the current per pin. The header includes an integral board guide that aligns the component during reflow and prevents the outer shroud contacts from skewing before the solder solidifies.
This header has a 4.45 mm height above the board, and it supports mated stacking heights of 5 mm and 10 mm when paired with the matching FX8C receptacle.
No direct replacement or official second-source is on record; the FX8C-120P-SV(92) is the same header in Tape & Reel packaging if your pick-and-place line prefers reel feed over tube.