Board-to-Board Mezzanine Interconnect for Dense Parallel Buses
With a 0.024" (0.60 mm) pitch and two rows of center strip contacts, it delivers a high-density interconnect for parallel signal buses—think processor-to-memory or FPGA-to-module links where every millimeter of board real estate counts. The gold-plated contacts and surface-mount termination suit automated assembly lines, while the integrated board guide aligns the mating header during reflow, preventing tombstoning on the fine-pitch pads.
Stack Height Flexibility Across One BOM Line
One connector, five mated stacking heights: 5 mm, 6 mm, 7 mm, 9 mm, and 11 mm. That range lets the board stack-up architect use the same receptacle across multiple board-spacing requirements—no need to qualify a different connector for each z-height. The 0.155" (3.95 mm) above-board height keeps the receptacle low-profile on the bottom board, leaving room for the mating header's height to set the final stack.