0.60mm Pitch Mezzanine Header for Dense Board Stacks
It uses a 0.024" (0.60mm) pitch — tight enough that the footprint looks like a BGA land pattern, not a traditional through-hole header. This variant sits at a 0.333" (8.45mm) height above board, which mates with a receptacle at one of two stacking heights: 9mm or 14mm. That 9mm stack is common for sandwiching a mezzanine card between two larger PCBs where the air gap needs to stay under 10mm for thermal or enclosure reasons. The board guide feature (molded into the shroud) helps align the two halves during blind mating — useful when the connector is buried in a dense board stack where you can't see the pins engage. Surface-mount termination keeps the assembly reflow-friendly, but the 140 pins at 0.60mm pitch mean the solder paste stencil and reflow profile need to be dialed in for that fine-pitch joint.
It is ROHS3 compliant, which covers the current EU exemption sunset.