High-Density Mezzanine Header at 0.60mm Pitch
The Hirose FX8C-140P-SV4(92) is a 140-position header from the FunctionMax™ FX8C series, designed for high-density board-to-board stacking. The 0.024" (0.60mm) pitch packs 140 gold-plated contacts into a dual-row surface-mount footprint, making it a fit for mezzanine applications where board real estate is tight and signal count is high. This header uses outer shroud contacts and includes an integrated board guide to assist alignment during assembly.
Stacking Height Options from One Header
A single FX8C-140P-SV4(92) supports two mated stacking heights — 9mm and 14mm — depending on the mating receptacle chosen. That means the same header BOM line can serve different board-spacing requirements across a product family, which simplifies inventory planning for a build. The 8.45mm height above board of this header is the middle option in the FX8C-140P range, sitting between the 6.45mm SV2 and the 10.85mm SV6 variants.
SMT Assembly and Packaging
Surface-mount termination and Tape & Reel packaging mean this header feeds directly into a pick-and-place line without a manual handling step. The board guide helps locate the part during reflow, reducing tombstoning risk on a 140-position part where alignment matters. No press-fit or through-hole step — it's a straight SMT process.