60-Position Mezzanine Header at 0.60mm Pitch
The Hirose FX8C-60P-SV2(92) is a 60-position header from the FunctionMax™ FX8C series, designed for high-density board-to-board mezzanine stacking. Typical applications include parallel board stacking in compact electronics where routing density and z-height control are critical — think portable instrumentation, telecom line cards, or embedded computing modules where every millimeter of board spacing is budgeted.
The outer shroud contacts provide initial alignment and strain relief during mating. Termination is surface-mount only — the SMT pads are gold-plated for solderability, and the board guide feature helps locate the part during pick-and-place. The 0.60mm pitch demands careful PCB layout: trace routing between pads is tight, and a solder mask defined pad is recommended to prevent bridging.