0.60 mm Pitch, 80-Position Mezzanine Header for Tight Board Stacks
Its 0.60 mm pitch packs 80 circuits into a dual-row layout, making it a fit for high-density signal interconnects in compact electronics like portable devices, servers, and telecom line cards. The header supports two mated stacking heights — 6 mm and 11 mm — depending on the receptacle chosen, giving the board designer flexibility in z-height budgeting.
Stacking Height Options and Board Spacing
The FX8C-80P-SV1(92) sits 5.45 mm above the board surface. When mated with the corresponding FX8C receptacle, the assembly achieves a total stack height of either 6 mm or 11 mm — the receptacle variant determines the final gap.
Surface Mount Termination and Packaging
Termination is surface mount, suited for reflow soldering on standard PCB pads. The gold finish on the contacts is consistent across the mating surface, providing a stable, low-resistance interface over the connector's service life.