Board-Stacking Header for Dense Mezzanine Designs
It uses a 0.024" (0.60mm) pitch across two rows, which is the tightest pitch in the FX8C line and drives the board routing density — trace escape between pads requires careful via placement or blind vias.
Stacking Height Options and Board Fit
This header supports two mated stacking heights: 5mm and 10mm, depending on the receptacle height selected. The 0.175" (4.45mm) height above board is the lowest in the FX8C-80P family — the SV1 variant rises to 0.214" (5.45mm), the SV2 to 0.254" (6.45mm), and the SV4 to 0.333" (8.45mm). For a 5mm total stack, the SV(93) mates with a 0.6mm-tall receptacle; for 10mm, the receptacle height increases to 5.6mm. The board guide feature centers the header during reflow and takes shear loads off the solder joints during mating — without it, the fine-pitch contacts risk bridging or lifting under off-axis insertion.