Mezzanine board spacing with the FX8C-80S-SV5(91)
It sits in the FX8C series at a 0.024" (0.60mm) pitch, dual-row, and is surface-mount terminated. The key selection parameter here is the mated stacking height — this receptacle supports 10mm, 11mm, 12mm, 14mm, and 16mm stack heights, giving the board layout engineer a range of z-axis spacing options between parallel PCBs.
80 circuits at 0.60mm pitch — footprint planning
With 80 positions spread across two rows at a 0.60mm pitch, this connector demands a fine-pitch SMT footprint. The 0.60mm pitch is tight enough that routing traces between pads requires careful PCB design — typically a micro-via or HDI board stack-up if all 80 signals need to escape the connector footprint.
Comparing the 8.95mm height variant to a lower-profile sibling
The FX8C-80S-SV5(91) has a height above board of 0.352" (8.95mm). The sibling FX8C-80S-SV(68) shares the same 80-position count, 0.60mm pitch, gold finish, and dual-row layout, but its height above board is 0.155" (3.95mm). The difference of roughly 5mm in body height directly affects the mated stack height range each supports — the taller (91) variant works with 10mm to 16mm stacks, while the shorter (68) variant is for tighter board spacing around 3.95mm. Choose the body height that fits your board-to-board z-axis budget.