JST PAD series, B10B-PADSS, Board to Cable/Wire header, 10 circuits, 2 rows, 2.00mm pitch, shrouded 4-wall, locking ramp, through-hole solder, tin contacts, 3 A, 250 V, 12.4 mm mated stack height, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | PAD |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | 3A |
| Operating temperature | -25°C ~ 85°C |
| Contact material | Copper Alloy |
| Insulation color | Natural |
| Insulation height | 0.402\" (10.20mm) |
| Insulation material | Polyamide (PA66), Nylon 6/6, Glass Filled |
| Parameter | Value |
|---|---|
| Mated stacking heights | 12.4mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 10 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.134\" (3.40mm) |
| Contact finish - mating | Tin |
Each tin-plated square pin is rated 3 A at 250 V, typical for signal-level interconnects in this pitch class. The through-hole solder tails measure 3.40 mm long, suitable for standard PCB thicknesses.
The 4-wall shroud fully encloses the pins, protecting them during handling and preventing bent pins during mating. Mated stack height is fixed at 12.4 mm, which sets the z-axis clearance needed in the enclosure.
The B10B-PADSS mates with a JST PAD series crimp receptacle housing (e.g., PAD-10) and the corresponding crimp terminals. The housing must be the same 10-position, 2.00 mm pitch, dual-row configuration.
No, the B10B-PADSS is listed as RoHS non-compliant. Verify your regional compliance requirements before specifying this part in a new design.