Molex C-Grid 71308 series, 0015911181, unshrouded breakaway header, 18 circuits, dual-row, 0.100" (2.54 mm) pitch, surface-mount, tin-plated contacts, UL94 V-0 LCP housing.
| Parameter | Value |
|---|---|
| Series | C-Grid 71308 |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Tube |
| Parameter | Value |
|---|---|
| Features | Board Guide |
| Shrouding | Unshrouded |
| Termination | Solder |
| Applications | Automotive, General Purpose, Lighting, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 18 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 150.0µin (3.81µm) |
The 0015911181: All 18 positions are loaded — no option for depopulated rows, so the BOM line count is fixed at 18 circuits.
Surface-mount solder tails eliminate through-hole drilling and allow reflow assembly alongside other SMT components, but the LCP (liquid crystal polymer) housing requires a reflow profile that stays within the material's 260°C peak capability.
Confirm the circuit count and keying of the mating half before ordering.