Molex C-Grid 71308 series, 0015913060, unshrouded breakaway header, 6 circuits, 2 rows, 0.100" (2.54 mm) pitch, surface-mount solder tails, 30 µ" gold on mating pins, tin on post, UL94 V-0 LCP housing.
| Parameter | Value |
|---|---|
| Series | C-Grid 71308 |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Applications | Automotive, General Purpose, Lighting, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 6 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 74.8µin (1.90µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The LCP glass-filled insulator holds up to reflow temperatures without warping.
For board-to-board applications, the unshrouded design allows the pins to pass through the mating header body — useful when stacking two PCBs with a controlled gap.
Buyers need to confirm the component is the correct Molex 0015913060, a C-Grid 71308 series header.
High-volume buyers need pricing to evaluate cost per unit for BOMs.
Sourcing buyers need to find available inventory to fill orders quickly.
Engineers and technicians often need to cross-reference similar parts for fit and function.
Design engineers need to ensure proper reflow soldering parameters for reliable connections.
Brokers and buyers need to know lifecycle status to plan long-term availability or find alternatives.