Molex KK254 series, 42375, unshrouded breakaway header, 10 positions, 2.54mm pitch, gold mating finish, through-hole solder termination, UL94 V-0 black nylon housing.
| Parameter | Value |
|---|---|
| Series | KK254, 42375 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Polyamide (PA), Nylon, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Parameter | Value |
|---|---|
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Overall contact length | 0.455\" (11.56mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 0022284103: The 2.54mm pitch matches the legacy 0.100-inch grid, so it drops into existing board layouts without a footprint change.
That gives enough reach to mate with a standard KK254 crimp housing or a board-to-board receptacle without bottoming out. Insulation height is 0.090 inches above the board — low enough to keep the profile tight in a card-edge or mezzanine stack.
The pitch is 2.54mm (0.100 inches) and it has 10 positions in a single row. The breakaway design allows snapping to fewer positions if needed.