Molex 0022288113, 11-Position KK254 Header, 0.100" (2.54mm) Pitch
Molex 0022288113, KK254 series, 11-position single-row breakaway header, 0.100" (2.54mm) pitch, right-angle through-hole, gold-over-nickel mating contacts (15.0 µin), tin-plated solder tails (100.0 µin), push-pull fastening, UL94 V-0 glass-filled polyamide housing, black insulation.
Specifications
| Parameter | Value |
|---|---|
| Series | KK254, 42377 |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Insulation color | Black |
| Insulation height | 0.098\" (2.50mm) |
| Insulation material | Polyamide (PA), Nylon, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
All specifications
| Parameter | Value |
|---|---|
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 11 |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.324\" (8.23mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Frequently asked questions
Where can I buy the 0022288113 and what is the lead time?
The 0022288113 is sourced to order through independent distribution against an RFQ — availability and current lead time are confirmed at quote time. No stock-holding or ship-today claim is made; submit the BOM quantity to receive a confirmed delivery estimate.
What does the 0022288113 mate with?
The 0022288113 is an 11-position, 0.100" (2.54 mm) pitch, unshrouded male breakaway header. It mates with any 0.100" pitch IDC receptacle, wire-to-board plug housing, or matching female header in the KK254 family — confirm the position count (11) and orientation (right-angle) match the mating half on the board or harness.
What is the contact plating on the 0022288113?
The mating face carries 15.0 µin (0.38 µm) gold over nickel; the solder-post side is 100.0 µin (2.54 µm) tin. The gold thickness on the mating side governs insertion-life and contact resistance across repeated mating cycles; the thick tin post is optimised for solder joint reliability.