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Molex 0026481050 — Pin Headers, Sockets & Housings

Molex 0026481050 Header 5pos 3.96mm Pitch Through-Hole

MPN0026481050
Active

Molex KK396/41661 series unshrouded male pin header, 5 positions, 0.156 inch (3.96 mm) pitch, through-hole solder termination, square brass contacts, tin-plated 60.0 µin (1.52 µm), push-pull fastening, UL94 V-0 glass-filled polyester housing, 0.128 inch (3.25 mm) insulation height.

$0.8100Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026

Specifications

0026481050 key specifications
ParameterValue
SeriesKK396, 41661
TypeMale Pin
MountingThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Contact materialBrass
Insulation colorBlack
Insulation height0.128\" (3.25mm)
Insulation materialPolyester, Glass Filled
Material flammability ratingUL94 V-0
StyleBoard to Board or Cable
PackageBulk

All specifications

0026481050 additional specifications
ParameterValue
ShroudingUnshrouded
TerminationSolder
ApplicationsAutomotive, General Purpose, Industrial, Medical, Telecommunications
Contact shapeSquare
Rows1
Pitch0.156\" (3.96mm)
Positions5
Contact finish - postTin
Contact length - post0.172\" (4.37mm)
Overall contact length0.890\" (22.61mm)
Contact finish - matingTin
Contact length - mating0.590\" (14.99mm)
Contact finish thickness - post60.0µin (1.52µm)
Contact finish thickness - mating60.0µin (1.52µm)

Frequently asked questions

What series is the 0026481050 listed under?

The 0026481050 is listed in the KK396 / 41661 series — the base product number is 002648 and the series designation ties it to the broader Molex KK396 family of unshrouded headers.

What is the connector style listed for the 0026481050?

The 0026481050 is listed with a Board to Board or Cable style — it is a breakaway header suited for either direct board-to-board stacking or cable-level interconnection via a mating receptacle or IDC housing.