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0026482065 — Molex product photo

Molex KK396 0026482065 Header, 6 Pos, 0.156" Pitch

MPN0026482065
Active

Molex KK396 header, order code 0026482065, 6 positions, single row, 0.156" (3.96 mm) pitch, through-hole solder, shrouded 1-wall with friction lock, gold-plated mating contacts, tin-plated posts, UL94 V-0 polyester housing.

$3.2300Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

0026482065 Technical Specifications
ParameterValue
SeriesKK396, 41671
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader, Breakaway
Fastening typeFriction Lock
Contact materialBrass
Insulation colorBlack
Insulation height0.500\" (12.70mm)
Insulation materialPolyester
Material flammability ratingUL94 V-0
StyleBoard to Board or Cable
PackageBulk
ShroudingShrouded - 1 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Industrial, Medical, Telecommunications
Contact shapeSquare
Rows1
Pitch0.156\" (3.96mm)
Positions6
Contact finish - postTin
Contact length - post0.172\" (4.37mm)
Overall contact length0.750\" (19.05mm)
Contact finish - matingGold
Contact length - mating0.450\" (11.43mm)
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating20.0µin (0.51µm)

Product details

The 0026482065: Gold-plated mating contacts rated for 20.0 µin (0.51 µm) thickness handle repeated mate cycles; the tin-plated posts and UL94 V-0 polyester housing suit general-purpose industrial and telecom board wiring.

Frequently asked questions

What is the 0026482065's connector style?

The 0026482065 is a Board to Board or Cable style header, designed for use in wire-to-board or board-to-board applications.