What it is
The Molex 1720430306 is the 3-circuit member of the Super Sabre 172043 series — a single-row, right-angle male header rated 30 A per position at 600 V, with a 7.50 mm pitch that puts it squarely in the mid-current wire-to-board class for power-interconnect applications. Silver plating at 100 µin (2.54 µm) thickness over copper gives the contact more current-carrying surface than the thin tin used on signal-grade headers, which is why the Super Sabre carries 30 A in a 3-position body without needing a larger pitch. The board-lock feature and finger-proof shrouding are the two design details that make this a board-layout header rather than a panel-mount: the lock stakes the header to the PCB during wave solder, and the shroud closes the gap between contacts so no live blade is exposed to accidental contact during handling or in-service. The locking ramp on the mating side adds a positive detent that resists vibration dislodgement — standard in harness assemblies where the header sees continuous mechanical load rather than one-time mate-and-forget.
What the ratings mean for fit
Pitch at 7.50 mm sets the board footprint and the minimum slot width in the PCB — confirm the routing channel and keep-out zone match before committing. At 30 A per circuit the current headroom is well above typical signal or low-power control lines; this header is suited for power branches feeding motors, inverters, or power supplies in industrial and transportation equipment. 600 V rating covers the AC and DC bus voltages common in industrial automation and EV auxiliary circuits. The operating temperature window of -40°C to 125°C covers the full industrial temperature range and the thermal cycling extremes found in equipment enclosures and under-hood zones. Through-hole solder termination with right-angle orientation means the header seats flush to the board edge and the mating face presents perpendicular to the PCB plane — standard for board-to-wire power interconnects where routing density is managed above the board. The black LCP glass-filled housing provides the base thermal and mechanical properties for enclosed power-interconnect applications.
Active production and compliance
Active and ROHS3 compliant per the official listing. Quoted to order against BOM quantity — confirm lead time and MOQ at your volume.