Board-Stacking Fit for Ultra-Thin Assemblies
At a 0.031" (0.80mm) pitch and a mated stack height of 0.8mm, this connector pairs with the matching SlimStack header to fit inside handheld devices, wearable electronics, or any assembly where the board gap is under a millimetre. The 8 positions are split 4 signal plus 4 power contacts, a layout that carries both a low-current data path and a separate power rail in a single connector body.
What the Position Split and Plating Mean
The 8 (4 + 4 Power) position count is the critical BOM-line match — verify your circuit count maps to this exact split before committing the footprint. The 0.031" (0.80mm) pitch drives a dense board layout; the 0.8mm mated stack height means the opposing board sits nearly flush, so confirm the component height on the underside clears the second board. Gold contacts at 4.00µin (0.100µm) are standard for the SlimStack series — adequate for the mating cycle count of a consumer device, though not as heavy as the 15µin+ gold used in high-reliability or corrosive environments.
Solder Retention During Reflow
The solder retention feature adds small tabs on the connector body that anchor into the PCB pads during reflow. This keeps the part from shifting under the mass of the pick-and-place nozzle and resists shear forces when the mated cable or board is handled. For a 0.8mm stack-height connector with no secondary mechanical lock, those tabs are the main defence against solder-joint fatigue in the field.
Surface-mount termination with gold-over-nickel contacts. The receptacle mates with the matching SlimStack 207419 series header — same 0.80mm pitch, same 0.8mm stack height. No crimp terminals or housings; this is a direct board-to-board interconnect. The two rows of contacts are centre-strip style, meaning the mating interface is a single row of beams along the centreline of the connector body.