What it is and where it sits
The Molex 430450614 is the 6-circuit member of the Micro-Fit 3.0 43045 series — a dual-row, 3.00 mm pitch header designed for board-to-cable power interconnect. Shrouded on all four walls with a locking ramp, it uses kinked pins for through-hole solder retention and carries gold-plated mating contacts (30.0 µin) over a tin-plated solder tail (100.0 µin). Rated 8 A per contact at the stated temperature reference, and 600 V maximum.
Mating gold thickness — the meaningful delta
The 430450614 mates with the standard Micro-Fit 3.0 receptacle housing and accepts the matching crimp terminal in the same way as every other member of the 43045 series. The 6-position footprint matches the series pinout, so the board layout accommodates any 6-position dual-row variant in this family. The 30.0 µin gold on the mating interface is the distinguishing spec against its closest peer 0430450625, which carries 15.0 µin — the thicker deposit extends the usable mating cycle window under the same mechanical latch, making it the better fit for any harness that sees repeated connect/disconnect in the field.
What the voltage and current ratings mean
At 600 V and 8 A per contact, the 430450614 sits comfortably in power-distribution territory for its pitch class. The dual-beam Micro-Fit contact geometry handles current distribution across the contact interface, so the per-contact figure is the design limit — not a total that derates with position count. The 8 A rating applies to the contact interface; the board-side solder tail thermal margin is governed by the through-hole pad layout and the LCP housing's 0.390" (9.91 mm) insulation height, which keeps the body clear of adjacent components on dense boards.
Production and compliance
The 430450614 is listed Active and ROHS3 Compliant. No official successor or cross-reference is on record — the sourcing path is quoted-to-order against the BOM quantity. For the compliance documentation a buyer asked about, the ROHS3 status is the primary entry; check with Molex directly for the full REACH/UL documentation package if the procurement QA process requires it.