The Molex 430451022 is the 10-circuit member of the Micro-Fit 3.0 43045 header series — a dual-row, 0.118" (3.00mm) pitch board-to-cable power header with a locking ramp and 4-wall shroud. Contacts are brass with gold plating on the mating face (15.0 µin) and tin on the solder tails (100.0 µin), delivering 8 A per circuit at up to 600 V in a right-angle through-hole footprint. The board-lock feature mechanically anchors the header in the PCB during solder reflow — it stays put when the board runs through the wave without a separate hold-down peg.
Dual-plating and what it means for the build
The 15.0 µin gold on the mating interface handles the plug insertions over the connector's life without the contact fretting that tin-on-tin encounters in high-vibration environments. The 100.0 µin tin on the post side is thick enough for a reliable solder joint in a mixed solder process — no special gold-finish board pad requirement. Rated for 8 A per circuit, which puts this header in mid-power territory — above the signal-level headers in the same pitch family, but below the dedicated power-only connectors. At that current the 3.00 mm pitch spacing gives adequate creepage between adjacent circuits at 600 V.
Sourcing and lifecycle
Active and ROHS3 compliant with no official successor on record — it is quoted to order against BOM quantity. The Micro-Fit 3.0 series is a mature Molex product family; check whether a higher-position variant covers your circuit count before committing to a custom panel layout. No cross-reference or alternate source listed for this specific order code. Mating halves and the matching crimp terminals ship separately — confirm both are on the same purchase order.