Plating grade drives the mating-side decision
The 430451411: The mating side carries 30.0 µin (0.76 µm) gold over nickel — the grade that gives the contact cycle life at the plug interface. The solder-post side is 100.0 µin (2.54 µm) tin, which is standard for SMT reflow: the thick tin wets reliably and survives multiple reflow passes without degrading the termination. Do not conflate the tin post with low quality — it is the correct finish for the board side of this hybrid plating scheme.
Sizing: 14 positions at 3.00 mm pitch
14 circuits across two rows at 0.118 in (3.00 mm) pitch gives a body width driven by the shroud — the 4-wall shroud adds non-functional material around the pin array, which matters if you are routing adjacent connectors or placing components in the keep-out zone. The insulation height of 0.290 in (7.37 mm) sets the mated stack profile for any vertical constraint check.
Where this class is used
Board-to-cable headers in this series are common in automotive control modules, industrial automation I/O, and medical equipment power rails — anywhere a shrouded, keyed connector prevents mis-mating under vibration.
14 vs 12 vs 16 — same series, different position count
The series scales in position count — the 3.00 mm pitch, dual-row shroud, and right-angle SMT footprint are consistent across variants.
Mating and termination
The 430451411 accepts the matching Micro-Fit 3.0 female receptacle housing — the locking ramp on the header snaps into a retention feature on the housing for positive engagement under shock and vibration. Termination is right-angle surface mount with solder posts — the solder retention feature on the post helps hold the header in the pad during reflow, particularly on any board that sees wave or selective solder downstream. Package is Tape & Reel or Cut Tape for automated placement.