The 14-circuit member of a long-run industrial family
The Molex 430451426 is the 14-position dual-row member of the Micro-Fit 3.0 43045 header series — a 3.00 mm pitch board-to-wire interconnect used across automotive, industrial, medical, and telecom applications. The 3.00 mm row spacing matches the pitch, so routing follows the same grid as the rest of the series. Rated 8 A per contact at 600 V, the header carries more current per circuit than most ribbon or signal headers of the same pitch, which is why it shows up in motor-drive and power-distribution harnesses rather than pure signal chains.
Plating split — what it means for the connection
What it mates with
This is a shrouded male header — it accepts the matching Micro-Fit 3.0 dual-row receptacle housing with the locking ramp as the primary latch. The four-wall shroud and the board-lock feature together make it a retention-first design: the shroud prevents mis-mating and the board lock keeps the header seated in the PCB during wave solder. The 0.390 inch (9.91 mm) insulation height gives the header enough standoff for board-clean or conformal-coating processes underneath. Verify the board thickness against the kinked-pin lead-in before committing to the layout.