What it is and where it sits in the series
The Molex 430451613 is the 16-circuit member of the Micro-Fit 3.0 43045 family — a dual-row 3.00 mm pitch header with a 4-wall shroud and a locking ramp that keeps the mated pair seated under shock and vibration. Rated 8 A per circuit at up to 600 V, it covers board-to-wire power and signal distribution in automotive, industrial, medical, and telecom harness applications. All 16 positions are loaded, so there is no partial-load option at this circuit count.
What the contact plating means for the fit
The mating-side gold flash (15.0 µin / 0.38 µm) is the durability layer — it drives the cycle life of the plug-receptacle interface and keeps contact resistance low across reconnection events. The post-side finish is 100.0 µin (2.54 µm) tin, which governs solderability and resistance to oxidation on the board-attachment side. These are two independent ratings: the gold side is not what gets soldered, and the tin side is not what gets mated. Buyers sourcing against a plating spec need to know which side they are specifying against. The base contact material is brass. At 8 A per circuit the current rating sits comfortably within the thermal envelope of the LCP glass-filled housing (UL94 V-0 rated), with an operating range of -40°C to 105°C. For elevated ambient-temperature deployments, derate per the product drawing — the datasheet carries the derating curve.
Termination and board fit
The kinked-pin through-hole termination provides mechanical retention in the PCB pad before solder reflow — the kink resists pull-out if the connector is handled before the solder joint is made. The board-guide feature aligns the header during placement, which matters on dense dual-row layouts where the 0.118-inch row spacing leaves little margin for misalignment. The insulation height is 0.390 in (9.91 mm); confirm the board keepout clears this in the z-axis to match the footprint.