Plating and what it means for the connection
The 430451814: The mating interface carries 30.0 µin (0.76 µm) gold, while the solder tail is 100.0 µin (2.54 µm) tin — a standard mixed-plating stack for this family. The gold thickness on the mating side governs cycle life and resistance at first mate; the thick tin on the post side ensures reliable solder joint integrity under board-level thermal cycling. All 18 positions are loaded.
The 3.00 mm pitch and 3.00 mm row spacing give a standard 0.118-inch dual-row footprint. The four-wall shroud and the locking ramp fastening type keep the mated pair from separating under vibration — the primary reason this series is specified in automotive and industrial harness runs rather than in low-cycle board-to-board applications.
Mating half and sourcing posture
Confirm the housing accepts 18 circuits and the same 3.00 mm dual-row pitch. Production status is Active and the part is ROHS3 Compliant; quoted to order against the BOM quantity per standard distributor practice.