What this is and where the ratings land
The Molex 430452007 is the 20-circuit member of the Micro-Fit 3.0 43045 series — a dual-row board-to-cable header rated 8 A per contact at 600 V, with a 3.00 mm pitch and a shrouded 4-wall body that carries the locking ramp and the board-lock feature for SMT coplanarity retention during reflow and in service. All 20 positions are loaded. The mating face carries gold at 15.0 µin (0.38 µm) over the brass contact; the solder-post side is tin at 100.0 µin (2.54 µm).
Plating grade drives the cycle life, not the first-mate resistance
The gold thickness on the mating side — 15.0 µin — is the thin/medium grade. For signal-level cycling this is adequate; for repeated high-current connects/disconnects the tin-post side is the limiting factor, not the contact plating. Current per circuit is 8 A, and the glass-filled LCP housing carries a UL94 V-0 rating — the connector will not propagate flame, which matters in enclosed industrial and medical enclosures where the header sits near the board edge.
Mating half and mechanical fit
The 430452007 mates with the matching Micro-Fit 3.0 43045 female receptacle housing — confirm the housing position count matches the 20 positions here. The locking ramp on the header body snaps into the housing latch and requires deliberate actuation to separate, so this is not a tool-free field disconnect. The board lock protrudes below the heel of the header to anchor it in the PCB paste mask and resist peel during thermal cycling; check the land-pattern keep-out to accommodate the lock tabs. Insulation height is 0.290" (7.37 mm), which sets the z-height budget for any secondary shield or cover that passes over the header after assembly. Termination is right-angle SMT solder — the solder-post finish is 100.0 µin of tin, which is a thick post-plating grade that wets well to HASL or ENIG pad finishes without pre-plating concern.
Where this connector class is specified
Board-to-cable headers in the Micro-Fit 3.0 series appear across automotive harness taps, industrial sensor node boards, and medical instrument panels — anywhere a 3.00 mm pitch dual-row power interconnect with decent current density and a positive locking feel is needed. The listed applications (Automotive, General Purpose, Industrial, Medical, Telecommunications) track the series footprint rather than implying any single OEM lock-in.