What this is
The Molex 430452011 is the 20-circuit dual-row member of the Micro-Fit 3.0 43045 series — a board-to-cable shrouded header with a locking ramp, right-angle surface-mount termination, and dual plating: 30.0 µin gold on the mating face and 100.0 µin tin on the solder tail.
What the ratings mean for your fit
At 8 A per circuit and 600 V, the 430452011 sits at the upper end of the Micro-Fit 3.0 current range — the 100.0 µin tin post plating on the solder tail is what gives the elevated current headroom, not the gold mating surface. Gold thickness on the mating interface (30.0 µin / 0.76 µm) governs reconnect cycle life, not current-carrying capacity. The 0.118-inch (3.00 mm) pitch and dual-row configuration with 0.118-inch row spacing keep the board footprint identical to every other member of the 43045 series — only the circuit count changes, so a layout is reusable across position-count variants. Four-wall shrouding and the locking ramp together provide the primary mechanical retention; the shroud also acts as a polarisation key for the matching receptacle housing, preventing mis-mate in dense harness runs. The solder retention feature holds the header in the PCB pad during reflow without a hold-down peg. Insulation height is 0.290 inches (7.37 mm); the LCP body is rated UL94 V-0 and the liquid crystal polymer construction resists the warp temperatures common in multi-row SMT assemblies.
Where this class is used
The Micro-Fit 3.0 43045 series is specified across automotive, industrial automation, medical device, and telecom harness applications. The 600 V rating and dual-plating strategy make it suited for both signal-level and low-to-medium power board-to-cable distribution — not just signal-only duty.
Sourcing and lifecycle
The 430452011 is listed Active with ROHS3 compliant status. No official successor order code appears in the current record. Quoted to order against BOM quantity; confirm lead time and full documentation package through the RFQ channel before committing to a production schedule.