Micro-Fit 3.0 43045 24-Circuit SMT Header
The Molex 430452419 is a dual-row, 24-circuit SMT header in the Micro-Fit 3.0 43045 series — a board-to-cable power interconnect with a locking ramp that positively mates and stays secured under vibration. The 0.118" (3.00 mm) pitch and 0.118" row spacing give a compact dual-row footprint suited to wire-to-board power and signal distribution in automotive control modules, industrial automation nodes, medical instrumentation, and telecom infrastructure. Contact plating is split across the interface: gold on the mating face at 15.0 µin (0.38 µm) handles repeated engagement cycles and maintains low resistance at the spring-to-pin interface; tin on the solder-post side at 100.0 µin (2.54 µm) gives a robust, wettable solder joint on the PCB. The brass contact body carries 8 A per circuit, and the LCP glass-filled housing is rated UL94 V-0 across an operating range of -40 to 105 °C. The 4-wall shroud encases the contact array and the locking ramp on the header housing guides the receptacle latch during mate, resisting accidental disengagement in high-vibration environments. Solder retention features on the post side help hold the header in the paste during SMT reflow before the solder wets — a practical aid on medium-to-high pad-count placements. Packaged in tape-and-reel or cut-tape; insulation is black, 0.390" (9.91 mm) height above board.
Sourcing and lifecycle
The 430452419 is Active and ROHS3 Compliant — no last-time-buy, no announced discontinuation on record. Quoted to order against BOM quantity. Confirm the 24-position circuit count matches the wire-side receptacle and terminal selection before committing; the series, pitch, and locking-ramp interface are shared across the full Micro-Fit 3.0 43045 position range.