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TE Connectivity AMP Connectors 1-1734261-4 — Pin Headers

1-1734261-4 TE Connectivity HPI Header SMD R/A 14POS 1.25mm

MPN1-1734261-4
Active

TE Connectivity AMP Connectors High Performance Interconnect (HPI) series, board-to-cable/wire header, 14 circuits, 1.25 mm pitch, SMD right-angle, shrouded 4-wall, tin-plated contacts, 1 A, 100 VAC.

$1.7068Ref. price · indicative, final on quote
RoHSNot applicable
SeriesHigh Performance Interconnect (HPI)
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

1-1734261-4 key specifications
ParameterValue
SeriesHigh Performance Interconnect (HPI)
TypeMale Pin
MountingSurface Mount, Right Angle
Connector typeHeader
Voltage rating100VAC
Current rating1A
Operating temperature-25°C ~ 85°C
Contact materialPhosphor Bronze
Insulation colorNatural
Insulation height0.136\" (3.46mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

1-1734261-4 additional specifications
ParameterValue
StyleBoard to Cable/Wire
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesSolder Retention
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Industrial, Medical
Contact shapeRectangular
Rows1
Pitch0.049\" (1.25mm)
Positions14
Contact finish - postTin
Contact finish - matingTin
Contact finish thickness - mating100.0µin (2.54µm)

Product details

Right-angle SMT header for board-to-wire in tight enclosures

Its right-angle SMD mounting lets the connector sit flush against the PCB edge, saving vertical clearance in low-profile enclosures.

1.25 mm pitch, 14 positions — signal-density sweet spot

At 1.25 mm pitch, this header packs 14 circuits into a compact footprint — denser than the 2.00 mm or 2.50 mm pitches of comparable TE headers like the CT or 2.50 mm HPI variants. The 1 A per-contact rating suits signal-level interconnects in automotive, industrial, and medical control boards.

SMT with solder retention — holds during reflow

The header includes solder retention features that keep it aligned on the PCB pads during reflow soldering, eliminating the need for secondary hold-down clips.

Frequently asked questions

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