TE Connectivity AMP Connectors Diplomate DL DIP socket, 20 (2 x 10) positions, 0.100" (2.54mm) pitch, 0.3" (7.62mm) row spacing, through-hole solder termination, 30µin gold mating finish, open frame, UL94 V-0.
| Parameter | Value |
|---|---|
| Type | DIP, 0.3\" (7.62mm) Row Spacing |
| Series | Diplomate DL |
| Mounting | Through Hole |
| Operating temperature | -55°C ~ 125°C |
| Housing material | Thermoplastic, Glass Filled |
| Contact material - post | Beryllium Copper |
| Contact material - mating | Beryllium Copper |
| Material flammability rating | UL94 V-0 |
| Package | Tube |
| Features | Open Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Parameter | Value |
|---|---|
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 30mOhm |
| Contact finish - post | Gold |
| Contact finish - mating | Gold |
| Termination post length | 0.128\" (3.24mm) |
| Contact finish thickness - post | 30.0µin (0.76µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
| Number of positions or pins | 20 (2 x 10) |
The 1-1825093-6 is a 20-position DIP socket from TE's Diplomate DL series, arranged in a 2 x 10 grid with 0.100" pitch and 0.3" row spacing — the standard footprint for 20-pin DIP ICs.
The open-frame design leaves the board visible under the socket, which helps with inspection and rework.
The 1-1825093-6 is an active TE Connectivity part. No stock-holding claim is made; sourcing is through independent distribution.
Yes. The 0.3 inch (7.62mm) row spacing and 0.100 inch (2.54mm) pitch match the standard 20-pin DIP IC footprint.