TE Connectivity AMPMODU board-to-board receptacle, 14 positions, 2 rows, 2.00 mm pitch, through-hole solder termination, 30.0 µinch gold mating finish, 2 A current rating, black LCP housing, UL94 V-0, -40°C to 125°C.
| Parameter | Value |
|---|---|
| Series | AMPMODU |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 125V |
| Current rating | 2A |
| Operating temperature | -40°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.177\" (4.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Features | Pick and Place |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 14 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.106\" (2.69mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 118.1µin (3.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 1-2314826-4: Supplied in tube packaging, with pick-and-place features for automated assembly.
The 2.00 mm pitch difference means the board footprint changes — 1-2314826-4 is not a direct pin-compatible replacement. The gold-to-tin plating difference also affects mating cycle life: 30 µinch gold vs 118.1 µinch tin. For a new design, stick with the 2.00 mm pitch family; for a repair, confirm the header pitch first.
No — this is a board-to-board receptacle (style listed as Board to Board). It mates with a pin header on another PCB, not with individual wires. For wire-to-board, look at the AMPMODU crimp socket housings in the same series.