The TE Connectivity 1735482-6 is a 140-position receptacle from the Free Height (FH) series, designed as the board-side half of a mezzanine board-to-board interconnect. The 0.031" (0.80mm) pitch and dual-row layout pack 140 circuits into a compact SMT footprint, with the outer shroud contacts guiding alignment during mating. Gold plating at 8.00µin on the contacts provides corrosion resistance for the expected mating cycles in production and field service.
Board Layout and Routing Considerations
At 0.80 mm pitch, the 140 positions require a tight via pattern and careful trace fan-out, especially on inner layers where the escape routing density is highest. The dual-row arrangement gives two columns of pads, which helps distribute the routing across both sides of the board but still demands a fine-line PCB capability for full population.
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