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TE Connectivity AMP Connectors 1746142-1 — Spring-Loaded Contacts

1746142-1 TE Connectivity Spring Battery Contact 3POS R/A

MPN1746142-1
Active

TE Connectivity AMP Connectors 1746142-1, spring-loaded battery contact, 3 positions, 0.126" (3.20mm) pitch, surface mount right-angle, gold 39.4µin finish, copper alloy, 1 row, active production, RoHS compliant.

$2.3500Ref. price · indicative, final on quote
RoHSRoHS Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1746142-1 specifications
ParameterValue
MountingSurface Mount, Right Angle
Connector typeBattery Contact
Positions3
MaterialCopper Alloy
Pitch0.126\" (3.20mm)
PackageTape & Reel (TR); Cut Tape (CT)
Contact finishGold
Rows1
Contact finish thickness39.4µin (1.00µm)

Product details

Spring-Loaded Battery Contact for Right-Angle Board Mount

The 1746142-1: The 0.126" (3.20mm) pitch sets the board footprint — the spring pogo pins compress against a battery cell or holder pad, maintaining contact under vibration and thermal cycling. Gold at this grade is standard for field-serviceable battery compartments where the connector sees quarterly or monthly swaps.

Right-angle SMD termination places the contact beam parallel to the board surface, keeping the z-height low for compact enclosures. No press-fit or through-hole step — the SMD pads are the only mechanical anchor, so the board footprint should include a solder fillet length that matches the contact beam's shear load from battery insertion force.

Frequently asked questions

What is the pitch of 1746142-1?

The pitch is 0.126" (3.20mm). This is the centre-to-centre spacing between the three spring contacts, and it drives the PCB footprint layout.

Can 1746142-1 be replaced with a similar spring-loaded battery connector?

No pin-compatible direct replacement is listed in the same series. The 0.126" pitch, 3-position single-row layout, right-angle SMD orientation, and 39.4µin gold plating are specific to this order code. Any alternative would require a board footprint change.